Advanced Packaging for High-Bandwidth Memory: Influences of TSV size, TSV...
A technical paper titled “Stress Issue of Vertical Connections in 3D Integration for High-Bandwidth Memory Applications” was published by researchers at National Yang Ming Chiao Tung University....
View ArticleHBM-Enabled FPGA-Based Graph Processing Accelerator
A technical paper titled “ACTS: A Near-Memory FPGA Graph Processing Framework” was published by researchers at University of Virginia and Samsung. Abstract: “Despite the high off-chip bandwidth and...
View ArticleAutomated Tool Flow From Domain-Specific Languages To Generate Massively...
A new technical paper titled “Automatic Creation of High-bandwidth Memory Architectures from Domain-specific Languages: The Case of Computational Fluid Dynamics” was published by researchers at...
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Pinpointing Timing Delays Can Improve Chip Reliability
Growing pressure to improve IC reliability in safety- and mission-critical applications is fueling demand for custom automated test pattern generation (ATPG) to detect small timing delays, and for chip...
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HBM’s Future: Necessary But Expensive
High-bandwidth memory (HBM) is becoming the memory of choice for hyperscalers, but there are still questions about its ultimate fate in the mainstream marketplace. While it’s well-established in data...
View ArticleGenerative AI Training With HBM3 Memory
One of the biggest, most talked about application drivers of hardware requirements today is the rise of Large Language Models (LLMs) and the generative AI which they make possible. The most well-known...
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DRAM Test And Inspection Just Gets Tougher
DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming much...
View ArticleThe Power Of HBM3 Memory For AI Training Hardware
AI training data sets are constantly growing, driving the need for hardware accelerators capable of handling terabyte-scale bandwidth. Among the array of memory technologies available, High Bandwidth...
View ArticleEnabling Scalable Accelerator Design On Distributed HBM-FPGAs (UCLA)
A technical paper titled “TAPA-CS: Enabling Scalable Accelerator Design on Distributed HBM-FPGAs” was published by researchers at University of California Los Angeles. Abstract: “Despite the increasing...
View ArticleWhat’s Missing In 2.5D EDA Tools
Gaps in EDA tool chains for 2.5D designs are limiting the adoption of this advanced packaging approach, which so far has been largely confined to high-performance computing. But as the rest of the chip...
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